Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1981-08-06
1983-10-04
Weisstuch, Aaron
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
204112R, C23C 1500
Patent
active
044077130
ABSTRACT:
The cylindrical magnetron sputtering cathode (10) of the present invention essentially comprises a tubular target (20) having a face (20a) of material to be sputtered, and a magnet assembly (45) disposed behind the back face of said tubular target for generating magnetic fields having flux lines which form arch portions (50,51) over the sputtering face. This magnet assembly (45) more specifically consists of a plurality of equiangularly spaced axially extending radially magnetized magnets arranged in such a manner as to form over the sputtering face (20a) a plurality of equiangularly spaced axially extending straight arch portions (50) connected to each other by arcuate arch end-portions (51), whereby defining at least one closed-loop arch (52) over said sputtering face. This magnetron sputtering cathode further comprises closure means for delimitating in combination with the back face of said tubular target a cylindrical tight chamber enclosing the magnet assembly, as well as means for axially circulating a liquid coolant within said tight chamber, whereby ensuring a proper cooling of said cathode by enabling said liquid coolant to freely flow along the longitudinal spaces (49) delimitated between adjacent magnets of said assembly.
REFERENCES:
patent: 3884793 (1975-05-01), Penfold et al.
patent: 3919678 (1975-11-01), Penfold
patent: 3995187 (1976-11-01), Penfold et al.
patent: 4030996 (1977-06-01), Penfold et al.
patent: 4031424 (1977-06-01), Penfold et al.
patent: 4179351 (1979-12-01), Hawton et al.
patent: 4198283 (1980-04-01), Class et al.
patent: 4221652 (1980-09-01), Kuriyama
patent: 4356073 (1982-10-01), McKelvey
"End Effects in Cylindrical Magnetron Sputtering Sources"-J. A. Thorton; Journal of Vacuum Science Technology, vol. 16(1) Jan./Feb. 1979, pp. 79-80.
"Design and Capabilities of a Novel Cylindrical Post Magnetron Sputtering Source" D. W. Hoffman-Ford Motor Co.; paper presented 4/5/82 in San Diego.
S. Schiller et al., "On the Use of Ring Gap Discharges for High-Rate Vacuum Coating", J. Voc. Sci. Technol., vol. 14, pp. 815-818 (1977).
"Thin Film Processes" (Edited by Vossen & Kern) Academic Press (1978); pp. 76-113, "Cylindrical Magnetron Sputtering"-J. A. Thorton & A. S. Penfold.
"Advances in High Rate Sputtering with Magnetron-Plasmatron Processing and Instrumentation"-S. Schiller et al.; Thin Solid Films, vol. 64 (1979) pp. 455-467.
Battelle Development Corporation
Bissell Barry S.
Weisstuch Aaron
LandOfFree
Cylindrical magnetron sputtering cathode and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Cylindrical magnetron sputtering cathode and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cylindrical magnetron sputtering cathode and apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-972384