Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1991-01-29
1992-04-28
Nguyen, Nam
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
20419212, 20429821, 20429811, C23C 1434
Patent
active
051085747
ABSTRACT:
A rotating cylindrical sputtering target surface as part of a magnetron has cylindrical shields adjacent each end of the target to prevent arcing that undesirably occurs when certain materials are being sputtered, particularly dielectrics. If two or more rotating targets are employed in a single magnetron system, each is similarly shielded. In a preferred form, the target is provided with a single cylindrical shield that is cut away for a significant portion of the distance around the cylinder to provide an opening through which a sputtering region of the target is accessible, while maintaining shielding of the target end regions. This preferred shield is rotatable in order to allow the position of the sputtering activity to be selected.
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Belkind Abraham I.
Boehmler Carolynn
Kirs Milan R.
Kurie J. Randall
Orban Zoltan
Draegert David A.
Nguyen Nam
Pearlman Robert I.
The BOC Group Inc.
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