Heat exchange – With retainer for removable article – Electrical component
Reexamination Certificate
2002-11-20
2004-03-30
Flanigan, Allen (Department: 3743)
Heat exchange
With retainer for removable article
Electrical component
C165S182000, C165S185000, C361S704000
Reexamination Certificate
active
06712128
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to a method and apparatus for removing heat from electronic equipment, and in particular, a heat exchanger system for removing heat from semiconductor chips.
DESCRIPTION OF THE RELATED ART
In the computer industry there is a need for low cost, high performance heat exchangers to cool components such as microprocessors and semiconductor chips. Heat exchangers often utilize heat sink mechanisms, such as spreaders and fins, to draw heat away from heat-producing components (e.g., microprocessors). Heat exchangers also typically include some type of circulation unit (e.g., fan, fluid loop, etc.) for further assisting in moving heat away from the heat-producing components.
European Patent Application No. EP 1,081,760 (A2) discloses a heat sink assembly
10
including a heat exchanger
18
and a cylindrical heat sink including a plurality of fins
28
. The heat sink assembly
10
also includes a fan assembly
12
disposed on one side of the heat exchanger
18
, and a base assembly
20
including a heat-producing electronic component
38
disposed on an opposing side of the heat exchanger. The heat sink is formed from a thermally conductive sheet
22
that is folded to form alternating ridges
24
and troughs
26
. The thermally conductive sheet
22
is disposed around a conductive rod
40
which abuts the electronic component
38
on one end, and the fan assembly
12
on the other end.
However, there are several drawbacks to the above-described heat sink assembly. One drawback is that the conductive rod
40
carrying the heat sink merely lies on top of the electronic component
38
. Thus, the weight of the fan assembly
12
is the only thing securing the rod and the heat sink to the component. This is a problem because a complex bracket system
54
and a heavy fan are necessary to hold the rod
40
and heat sink against the electronic component
38
. Another drawback is that the folded heat sink structure must be formed by folding a flat thermally conductive sheet into a cylindrical form. The machinery required for performing such folding is often expensive and complex. Moreover, a manufacturer may experience difficulty folding thicker sheets.
Therefore, there is currently a need for a heat exchanger system which is simpler and easier to produce than present systems.
SUMMARY OF THE INVENTION
The present invention comprises an air flow apparatus comprising an elongate post and a plurality of fin disks disposed on the elongate post, each fin disk including a centrally disposed opening for receiving the elongate post, and a plurality of flow openings disposed around the periphery of the centrally disposed opening.
The present invention also comprises a heat exchanger system comprising an air flow apparatus including an elongate post and a plurality of fin disks disposed on the elongate post, each fin disk including a centrally disposed opening for receiving the elongate post, and a plurality of flow openings disposed around the periphery of the centrally disposed opening and, a circulation device.
The above and other advantages and features of the present invention will be better understood from the following detailed description of the exemplary embodiments of the invention which is provided in connection with the accompanying drawings.
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patent: 5484013 (1996-01-01), Morikawa et al.
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patent: 5784257 (1998-07-01), Tata
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patent: 1 081 760 (2001-03-01), None
patent: 1.467.264 (1966-12-01), None
Molex Brochure; Thermal Acoustic Products; 8 pages; 2001.
Molex Brochure; Thermal Acoustic Products Application Specification; 7 page; Jan. 2001.
Molex.com; 4 internet pages; Thermal Acoustic Products, Aug. 2001.
Dussinger Peter M.
Sarraf David
Duane Morris LLP
Flanigan Allen
Thermal Corp.
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