Cyclosilazane polymers as dielectric films in integrated circuit

Details Cyclosilazane polymers as dielectric films in integrated circuit Cyclosilazane polymers as dielectric films in integrated circuit

1986-11-03

1988-01-12

Marquis, Melvyn I.

Fishing, trapping, and vermin destroying

427387, 528 28, 528 37, 428446, 428447, 437238, B05D 512

Patent

active

047191252

ABSTRACT:
An improved method is presented for the deposition of dielectric films in the fabrication of integrated circuits (ICs), wherein a solution of polymers derived from cyclosilazanes is employed to deposit dielectric films on semiconductor substrates by the spin-on technique. These spin-on films planarize (smooth out) underlying substrate topography and therefore are especially advantageous in multilevel metallization processes where they allow a highly uniform and continuous deposition of a subsequent layer of metallization resulting in improved yield and reliability of ICs.

REFERENCES:
patent: 2885370 (1959-05-01), Groszos et al.
patent: 3143514 (1964-08-01), Boyer
patent: 3228895 (1966-01-01), Burks, Jr. et al.
patent: 3539609 (1970-11-01), Fink
patent: 3652324 (1972-03-01), Chu et al.
patent: 4103045 (1978-07-01), Lesaicherre et al.
patent: 4656300 (1987-04-01), Lebrun et al.
Eaborn, "Organosilicon Compounds, Academic Press, Inc., New York, pp. 2-9 (1960).
R. E. Burks, Jr. et al., Journal of Applied Polymer Science, 9, pp. 2811-2817 (1965).
S. D. Brewer et al., J.A.C.S., 70, 3888 (1948).
E. Larsson et al., J.A.C.S., 75, 995-997 (1953).
R. Minne et al., J.A.C.S., 82, 5625-5628 (1960).

Affiliated with

Also associated with

Rating

Cyclosilazane polymers as dielectric films in integrated circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cyclosilazane polymers as dielectric films in integrated circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cyclosilazane polymers as dielectric films in integrated circuit will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-920792