Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate
2007-05-15
2007-05-15
Teskin, Fred (Department: 1713)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
C438S780000, C438S781000, C427S385500
Reexamination Certificate
active
10976627
ABSTRACT:
An embodiment is a cyclic olefin semiconductor package. Further an embodiment is a combination of a cyclic olefin monomer and a ruthenium-based catalyst that is stable at approximately room temperature and humidity for extended storage life and pot life, and that can be screen printed or valve/jet deposited.
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patent: 2002/0139975 (2002-10-01), Lewis et al.
patent: 2006/0106174 (2006-05-01), Ohkita et al.
Melanie S. Sanford, et al., “A Versatile Precursor for the Synthesis of New Ruthenium Olefin Metathesis Catalysts,” Organometallics 2001, pp. 5314-5318, vol. 20, No. 25, American Chemical Society.
Melanie S. Sanford, et al., “Mechanism and Activity of Ruthenium Olefin Metathesis Catalysts,” J. Am. Chem. Soc. 2001, pp. 6543-6554, vol. 123, No. 27, American Chemical Society.
Tina M. Trnka, et al., “Synthesis and Activity of Ruthenium Alkylidene Complexes Coordinated with Phosphine and N-Heterocyclic Carbene Ligands,” J. Am. Chem. Soc. 2003, pp. 2546-2558, vol. 125, No. 9, American Chemical Society.
Blakely , Sokoloff, Taylor & Zafman LLP
Intel Corporation
Teskin Fred
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