Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly single metal coating
Patent
1993-02-19
1994-04-12
Niebling, John
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Depositing predominantly single metal coating
205263, 205266, 205267, 205291, C25D 338
Patent
active
053022785
ABSTRACT:
A solution for use in electroplating which comprises at least one monovalent metal such as copper, silver or gold which is complexed by a thiosulfate ion; and a stabilizer of an organic sulfinate compound such as, for example, one having the formula R-SO.sub.2 -X wherein R is an alkyl, heterocyclic or aryl moiety and X is a monovalent cation. The stabilizer is present in an amount sufficient to stabilize the thiosulfate ion when the solution is operated at an acidic pH of less than 7. Also, the solution is substantially free of cyanide.
REFERENCES:
patent: 1969553 (1934-08-01), Gernes
patent: 3984292 (1976-10-01), Culjkovic
patent: 4067784 (1978-01-01), Leahy et al.
patent: 4540473 (1985-09-01), Bindra et al.
F. I. Kukov et al., "Thiosulphate Silver Plating Electrolyte", Inter-Republican Sci. and Techn. Conf., Volgograd Engng. Inst. Volgograd (1990), pp. 51-53.
D. C. Gernes et al., "Single Metal Deposition of Copper, Cadmium, Zinc and Nickel from Thiosulfate Solutions," Seventy-Seventh General Meeting, Apr. 26, 1940, pp. 177-207.
C. Barnes, "A Non-Cyanide Coppere Plating Solution Based on a Cuprous Salt," Institute of Metal Finishing Annual Technical Conference, Harrogate, May 5-9, 1981, pp. 201-210.
Brasch William R.
Drago Anthony J.
Nobel Fred I.
Lea-Ronal, Inc.
Mayekar Kishor
Niebling John
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