Cyanide-free plating solutions for monovalent metals

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly single metal coating

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205267, 205296, 205239, 205242, 205247, 106 123, C25D 338

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active

RE0355135

ABSTRACT:
A solution for use in electroplating which comprises at least one monovalent metal such as copper, silver or gold which is complexed by a thiosulfate ion; and a stabilizer of an organic sulfinate compound such as, for example, one having the formula R-SO.sub.2 -X wherein R is an alkyl, heterocyclic or aryl moiety and X is a monovalent cation. The stabilizer is present in an amount sufficient to stabilize the thiosulfate ion when the solution is operated at an acidic pH of less than 7. Also, the solution is substantially free of cyanide.

REFERENCES:
patent: 1969553 (1934-08-01), Gernes
patent: 3984292 (1976-10-01), Culjkovi
patent: 4067784 (1978-01-01), Leahy et al.
patent: 4540473 (1985-09-01), Bindra et al.
F. I. Kukov et al., "Thiosulfate Silver Plating Electrolyte", Inter-Republican Sci. and Techn. Conf., Volgograd Engng. Inst. Volgograd (1990), pp. 51-53. No month available.
C. Barnes, "A Non-Cyanide Copper Plating Solution Based on a Cuprous Salt", Institute of Metal Finishing Annual Technical Conference, Harrogate, May 5-9, 1981, pp. 201-210.
D. C. Gernes et al., "Single Metal Deposition of Copper, Cadmium, Zinc and Nickel from Thiosulfate Solutions", Seventy-Seventh General Meeting, Apr. 26, 1940, pp. 177-207.

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