Cyanide-free copper plating process

Details Cyanide-free copper plating process Cyanide-free copper plating process

1983-01-03

1984-09-04

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

C25D 338

Patent

active

044695691

ABSTRACT:
A cyanide-free electrolyte and process for depositing a ductile, fine-grained, adherent copper plate usually of a thickness of about 0.015 to about 5 mils on ferrous-base, copper-base, zinc-base and the like conductive substrates. The electrolyte contains controlled effective amounts of cupric ions complexed with an organo-phosphonate chelating agent, an alkali carbonate as a bath stabilizing and buffering agent, hydroxyl ions to provide a pH on the alkaline side and preferably, a wetting agent. The copper plate is applied by electrolyzing the aforementioned electrolyte employing a combination of a bath soluble copper anode and an insoluble ferrite anode to provide a copper to ferrite anode surface area ratio within a range of about 1:2 to about 1:6.

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S. Wakabayashi et al., J. De Physique, No. 4, pp. C1-241 to C1-244, Apr. 1977.
J. K. Dennis et al., "Nickel and Chromium Plating", pp. 67-68, (1972).
Allen G. Gray, "Modern Electroplating", pp. 8-10, (1953).

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