Cyanide-free copper plating process

Details Cyanide-free copper plating process Cyanide-free copper plating process

1989-07-24

1990-06-12

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204237, 204238, C25D 338, C25D 2118

Patent

active

049330519

ABSTRACT:
A process for electroplating copper from an aqueous alkaline non-cyanide bath has improved resistance to degradation. At least a portion of the plating bath is subjected to electrolysis by an insoluble anode to which the current is controlled independently from the current to the soluble copper anode in order to reduce the level of bath impurities and maintain the quality of the deposit.

REFERENCES:
patent: 1465034 (1923-08-01), Antisell
patent: 4462874 (1984-07-01), Tomaszewski et al.
patent: 4469569 (1984-09-01), Tomaszewski et al.
patent: 4521282 (1985-06-01), Tremmel

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