Cyanide-free copper plating process

Details Cyanide-free copper plating process Cyanide-free copper plating process

1983-11-16

1984-07-31

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204231, 204290R, 204293, 428680, C25D 338

Patent

active

044628749

ABSTRACT:
A process for depositing a ductile, fine-grained adherent copper plate on a conductive substrate employing an electrolyte containing controlled effective amounts of cupric ions, a complexing agent for the cupric ions, a bath stabilizing and buffering agent, and hydroxyl and/or hydrogen ions to provide a pH from about 6 to about 10.5. The process includes electrolyzing the aforementioned electrolyte employing a combination of a bath soluble copper anode and an insoluble nickel-iron alloy anode containing about 10 percent to about 40 percent by weight iron and about 0.005 to about 0.06 percent sulfur to provide a copper anode area to nickel-iron alloy anode surface area ratio within a range of about 1:2 to about 4:1. The invention further contemplates a novel nickel-iron alloy anode for use in the practice of the disclosed process.

REFERENCES:
patent: 3806429 (1974-04-01), Clauss et al.
patent: 3974044 (1976-08-01), Tremmel
patent: 4179343 (1979-12-01), Tremmel
patent: 4419192 (1983-12-01), Dahms

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