Cyanate ester adhesives for electronic applications

Details Cyanate ester adhesives for electronic applications Cyanate ester adhesives for electronic applications

1990-08-20

1992-09-01

Seidleck, James J.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

252512, 252514, 428355, 522 66, 522126, 522146, 525 56, 525403, 525420, 525436, 525437, 525462, 525535, B32B 712, H01B 122, C08F 246, C08J 328, C08L 2914, C08L 6702, C08L 6900, C08L 7102, C08L 7706

Patent

active

051437856

ABSTRACT:
The present invention provides an adhesive composition that is useful as an energy-curable, one-part adhesive, suitable for bonding electronic components. The adhesive composition, preferably provided as an adhesive film, comprises the reaction product of an admixture of an effective amount of a curable cyanate ester resin, a thermoplastic polymer, and a curing catalyst. The catalyst may be, for example, thermally or photochemically activated.

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