CVD diamond enhanced microprocessor cooling system

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S760000, C361S741000, C174S259000, C174S261000

Reexamination Certificate

active

07339791

ABSTRACT:
Cooling systems for microprocessors are addressed. Some systems may include a chemical vapor deposited (CVD) diamond heatspreader mounted to a base of a heat sink and to a microprocessor chip, while others may include a copper insert mounted within a depression of a heat sink, with the CVD diamond heatspreader mounted within an indent of the insert.

REFERENCES:
patent: 3243498 (1966-03-01), Allen et al.
patent: 3351543 (1967-11-01), Vanderslice
patent: 3356473 (1967-12-01), Hull et al.
patent: 3816194 (1974-06-01), Kroger et al.
patent: 4117968 (1978-10-01), Naidich et al.
patent: 4342632 (1982-08-01), Heim et al.
patent: 4425195 (1984-01-01), Papanicolaou
patent: 4738689 (1988-04-01), Gigl et al.
patent: 4776862 (1988-10-01), Wiand
patent: 4899922 (1990-02-01), Slutz et al.
patent: 4931363 (1990-06-01), Slutz et al.
patent: 5008737 (1991-04-01), Burnham et al.
patent: 5024680 (1991-06-01), Chen et al.
patent: 5186973 (1993-02-01), Garg et al.
patent: 5224969 (1993-07-01), Chen et al.
patent: 5234153 (1993-08-01), Bacon et al.
patent: 5239746 (1993-08-01), Goldman
patent: 5250086 (1993-10-01), McEachron et al.
patent: 5299214 (1994-03-01), Nakamura et al.
patent: 5324987 (1994-06-01), Iacovangelo et al.
patent: 5328715 (1994-07-01), Iacovangelo et al.
patent: 5348108 (1994-09-01), Scott et al.
patent: 5371407 (1994-12-01), Goldman
patent: 5382758 (1995-01-01), Iacovangelo et al.
patent: 5455457 (1995-10-01), Kurokawa
patent: 5457342 (1995-10-01), Herbst, II
patent: 5495126 (1996-02-01), Iguchi et al.
patent: 5500248 (1996-03-01), Iacovangelo et al.
patent: 5529805 (1996-06-01), Iacovangelo et al.
patent: 5567985 (1996-10-01), Iacovangelo et al.
patent: 5619399 (1997-04-01), Mok
patent: 5626909 (1997-05-01), Iacovangelo
patent: 5696665 (1997-12-01), Nagy
patent: 5734554 (1998-03-01), Mitty et al.
patent: 5767578 (1998-06-01), Chang et al.
patent: RE35845 (1998-07-01), Butera
patent: 5786633 (1998-07-01), Wolfgang et al.
patent: 5787971 (1998-08-01), Dodson
patent: 5804321 (1998-09-01), Thorpe et al.
patent: 5849413 (1998-12-01), Zhu et al.
patent: 5853888 (1998-12-01), Dutta et al.
patent: 5858537 (1999-01-01), Brown et al.
patent: 5874175 (1999-02-01), Li
patent: 5940269 (1999-08-01), Ko et al.
patent: 6019165 (2000-02-01), Batchelder
patent: 6021844 (2000-02-01), Batchelder
patent: 6068070 (2000-05-01), Scott
patent: 6114761 (2000-09-01), Mertol et al.
patent: 6181556 (2001-01-01), Allman
patent: 6531226 (2003-03-01), Petkie
patent: 6914330 (2005-07-01), Kneringer et al.
patent: 6919525 (2005-07-01), Pinneo
patent: 2002/0114963 (2002-08-01), Petkie
patent: 2003/0183368 (2003-10-01), Paradis et al.
patent: 0 284 150 (1988-09-01), None
patent: 51-94771 (1976-08-01), None
patent: 0 140 600 (1985-05-01), None
patent: 61-144036 (1986-07-01), None
patent: 62-24647 (1987-02-01), None
patent: 62-224048 (1987-10-01), None
patent: 2-226749 (1990-09-01), None
patent: WO 80/01222 (1980-06-01), None
patent: WO 01/31082 (2001-05-01), None
patent: WO 01/92185 (2001-12-01), None
patent: WO 02/058143 (2002-07-01), None
patent: WO 03/027043 (2003-04-01), None
Hoover,, et al., “Diamond Thin Film: Applications in Electronics Packaging,”Slid State Technology, pp. 89-91 (Feb. 1991).
Dahlgren, et al., “High-Pressure Polycrystalline Diamond as a Cost Effective Heat Spreader,”2000 Inter Society Conference on Thermal Phenomena, pp. 296-303 (2000).
Database WPI Section Ch, Week 197640, Derwent Publications Ltd., London, GB; AN 1976-74815X XP002178785 & JP 51 094771 A (Nippon Teleg & Tel Corp), Aug. 19, 1976 Abstract.
Petkie, Ronald, “Packaging Aspects of CVD Diamond in High Performance Electronics Requiring Enhanced Thermal Management,”1998 International Symposium on Advanced Packaging Materials, Mar. 15-18, 1998, pp. 223-228.
Jahangir, et al., “A highly adhesive gold-based metallization system for CVD diamond substrates,”Proceedings of the Sixth International Symposium(Electrochemical Society Proceedings), Honolulu, Hawaii, Oct. 17-22, 1999 (Abstract XP-002178784).

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