Coating apparatus – Gas or vapor deposition – With treating means
Patent
1989-12-07
1991-11-05
Bueker, Richard
Coating apparatus
Gas or vapor deposition
With treating means
427 39, C23C 1648
Patent
active
050625080
ABSTRACT:
A plasma or photo-induced chemical vapor deposition coating process and apparatus are provided for applying thin dielectric coatings on planar, curved, and large area substrates. A plasma is generated in a tubular outer conductor. This plasma or the UV radiation occurring in the plasma passes through an opening into a reaction chamber. The opening preferably extends axially along the outer conductor and communicates with the interior of the reaction chamber. At least one component of the reaction gas is introduced directly to the opening or into the reaction gas is introduced directly to the opening or into the reaction chamber adjacent to the opening, bypassing the outer conductor. In this apparatus, the reactive deposition of a coating onto a substrate occurs only in the reaction chamber and below the opening from the outer conductor.
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Ackermann Ulrich
Etzkorn Heinz-Werner
Kersten Ralf T.
Paquet Volker
Rutze Uwe
Bueker Richard
Schott Glaswerke
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