Cutting wheel

Details Cutting wheel Cutting wheel

1978-06-12

1979-12-25

Whitehead, Harold D.

Stone working

Sawing

Rotary

51206R, B28D 104

Patent

active

041800486

ABSTRACT:
An improved cutting wheel for dicing semiconductor wafers is described. The cutting blade of the wheel is a thin disc consisting of finely divided abrasive particles embedded in a nickel matrix. The surface of the nickel is overlaid with a thin layer of chromium which is electrolytically deposited on it. The cutting speed and useful life of the wheel are both increased by the presence of the chromium overlay.

REFERENCES:
patent: 3553905 (1971-01-01), Lemelson
patent: 3691707 (1972-09-01), Vonarx
patent: 3886925 (1975-06-01), Regan

Affiliated with

Also associated with

Rating

Cutting wheel does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cutting wheel, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cutting wheel will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2066993