Stone working – Sawing – Reciprocating
Reexamination Certificate
2007-10-23
2007-10-23
Ackun, Jr., Jacob k. (Department: 3723)
Stone working
Sawing
Reciprocating
C125S021000, C451S305000, C269S909000
Reexamination Certificate
active
11637118
ABSTRACT:
In a cutting method by a wire saw, in which a wire A at a wire array wound around work rollers10is made to reciprocate or travel in one direction at a high speed and numerous pieces of wafers are cut out in abutment of a workpiece B against the wire array, a receiving member27of a cassette type having numerous support wires34arranged at the same pitch as that of the wire at the wire array is disposed at a position immediately under the wire array for cutting the workpiece B; and wafers b cut out of the workpiece B by the wire A are contained in separation one from another between the support wires34in the receiving member27. Thus, the wafers can be prevented from adhering to each other during a cutting operation, thus to be accurately cut, and further, the wafers can be prevented from being cracked during the cutting operation, thus to be efficiently separated one from another, so as to enhance wafer cleansing performance.
REFERENCES:
patent: 3889699 (1975-06-01), Ranieri
patent: 6419779 (2002-07-01), DePetrillo et al.
Ackun, Jr. Jacob k.
Takatori Corporation
Wenderoth , Lind & Ponack, L.L.P.
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