Cutting method and cutting apparatus

Details Cutting method and cutting apparatus Cutting method and cutting apparatus

2006-09-13

2008-03-25

Morgan, Eileen P. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With feeding of tool or work holder

C451S041000, C451S910000, C125S013010, C125S016010, C083S049000, C083S956000

Reexamination Certificate

active

07347766

ABSTRACT:
The invention provides a cutting method and a cutting apparatus that cuts without chipping a composite material consisting of laminated layers of crystal material and amorphous material, in which the amorphous material is cut with an ultrasonically vibrated cutting blade and the crystal material is cut with a cutting blade that does not ultrasonically vibrate. With such a method and apparatus, the crystal material portion and the amorphous material portion of the composite material can be cut cleanly without chipping.

REFERENCES:
patent: 4790465 (1988-12-01), Fellows et al.
patent: 4930486 (1990-06-01), Kuromatsu
patent: 01184104 (1989-07-01), None
patent: 02113907 (1990-04-01), None
patent: 2000-210928 (2000-08-01), None
patent: 2002-336775 (2002-11-01), None

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