Cutting method and apparatus for removing a secondary coating la

Details Cutting method and apparatus for removing a secondary coating la Cutting method and apparatus for removing a secondary coating la

1993-08-17

1994-10-25

Healy, Brian

Optical waveguides

Accessories

385100, 385136, 385137, 385147, 83 13, 83879, 83880, 83885, 83887, 225 1, 225 3, 225 69, 225 94, 225 965, 81 94, 81 951, 81 943, G02B 644, B26D 100, B26F 300, H02G 112

Patent

active

053596900

ABSTRACT:
A jacket layer of a jacketed optical fiber is cut by a cutting method and apparatus in which (A) a terminal portion of a jacketed optical fiber is straightened and grasped by a fiber holder, and (B) a blade device having (a) a pair of cutting blades and (b) a blade holder in which device cutting edges of the blades are arranged in such a manner that the edges are opposite to each other through a gap left therebetween and are on one and the same plane, the straightened portion of the jacketed optical fiber extends at a substantially right angle to the plane, and a center line of the gap between the cutting edges intersects an axis of the straightened portion of the jacketed optical fiber, and is moved in at least one direction at a substantially right angle to the axis of the straightened portion of the jacketed optical fiber to cut the secondary coating layer at a depth equal to or larger than the thickness of the secondary coating layer but smaller than the total thickness of the primary and secondary coating layers.

REFERENCES:
patent: 4434554 (1984-03-01), Korbelak
patent: 4969703 (1990-11-01), Fyfe et al.
patent: 5033335 (1991-07-01), Yatsu et al.
patent: 5172620 (1992-12-01), Faust
patent: 5235664 (1993-08-01), Okada et al.

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