Cutting and forming device for lead frame for the semiconductor

Details Cutting and forming device for lead frame for the semiconductor Cutting and forming device for lead frame for the semiconductor

1992-06-18

1994-08-09

Jones, David

Wireworking

Crimping

29741, 72452, B21F 100

Patent

active

053357027

ABSTRACT:
A cutting and forming device of a lead frame of a resin molded semi-finished semiconductor device makes use of a press mechanism having a speed deceleration function in the vicinity of a bottom dead point of a press ram. The device includes an upper die base and a lower die base, a stripper frame, a die, a feeder for lead frames, and a machine base. The feeder is mounted over the lower die base and fixed to the machine base. In order to reduce impact noise when the stripper frame and the feeder abut with each other, there is provided an air cylinder mounted on the machine base and a cam follower plate fixed to an underside of the lower die base as well as a cam plate slidably mounted on the machine base for horizontal movement by the air cylinder which is driven by a driving mechanism independent from that for the press ram. In an alternative arrangement, the air cylinder may be fixed to the lower die base and carry the feeder in such a way as to allow the feeder to move up and down through the air cylinder. All the noise making impacts concentrate in the vicinity of the bottom dead point of the press ram and this enables to reduce noise during the press operation.

REFERENCES:
patent: 3872898 (1975-03-01), Parks
patent: 4817266 (1989-04-01), Holcomb
patent: 4819699 (1989-04-01), Brown et al.
patent: 4862929 (1989-09-01), Perry
patent: 4918956 (1990-04-01), Schoch
patent: 4958722 (1990-09-01), Kobayashi et al.
patent: 4972572 (1990-11-01), Kimura et al.
patent: 5012664 (1991-05-01), Hembree
patent: 5048412 (1991-09-01), Murakami
patent: 5070916 (1991-12-01), Biesecker
patent: 5105857 (1992-04-01), Ellis

Affiliated with

Also associated with

Rating

Cutting and forming device for lead frame for the semiconductor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cutting and forming device for lead frame for the semiconductor , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cutting and forming device for lead frame for the semiconductor will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-210088