Cut-and-paste imprint lithographic mold and method therefor

Details Cut-and-paste imprint lithographic mold and method therefor Cut-and-paste imprint lithographic mold and method therefor

2004-11-19

2008-03-18

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Formation of electrically isolated lateral semiconductive...

Having substrate registration feature

C438S692000, C438S706000, C438S738000, C438S745000, C438S748000, C257SE21024

Reexamination Certificate

active

07344955

ABSTRACT:
A method (and apparatus) of replicating a pattern on a structure, includes using imprint lithography to replicate a pattern formed on a first structure onto a portion of a second structure.

REFERENCES:
patent: 5756234 (1998-05-01), Groves et al.
patent: 6485870 (2002-11-01), Uchikawa
patent: 6814898 (2004-11-01), Deeman et al.
patent: 2003/0205658 (2003-11-01), Voisin
patent: 2004/0021866 (2004-02-01), Watts et al.

Affiliated with

Also associated with

Rating

Cut-and-paste imprint lithographic mold and method therefor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cut-and-paste imprint lithographic mold and method therefor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cut-and-paste imprint lithographic mold and method therefor will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3971173