Abrading – Flexible-member tool – per se – Interrupted or composite work face
Reexamination Certificate
2006-03-28
2006-03-28
Rachuba, M. (Department: 3723)
Abrading
Flexible-member tool, per se
Interrupted or composite work face
C451S530000, C451S533000, C451S539000
Reexamination Certificate
active
07018282
ABSTRACT:
The present invention comprises a customized polishing pad for use in a wafer polishing machine. The polishing pad of the present invention includes a polishing surface integral with the polishing pad. The polishing surface is adapted to frictionally contact a wafer in the polishing machine, thereby polishing the wafer. The polishing surface of the polishing pad includes at least two areas, where each area is adapted to frictionally contact the wafer and achieve a polishing effect specific for that area. A customized polishing effect is achieved by the polishing pad of the present invention when the wafer is selectively moved frictionally against the at least two areas by the wafer polishing machine.
REFERENCES:
patent: 959054 (1910-05-01), Glover
patent: 5212910 (1993-05-01), Breivogel et al.
patent: 5287663 (1994-02-01), Pierce et al.
patent: 5390449 (1995-02-01), Hilton
patent: 5421769 (1995-06-01), Schultz et al.
patent: 5534106 (1996-07-01), Cote et al.
patent: 5564965 (1996-10-01), Tanaka et al.
patent: 5578099 (1996-11-01), Neff
patent: 5609517 (1997-03-01), Lofaro
patent: 5664989 (1997-09-01), Nakata et al.
Drill Charles Franklin
Weling Milind
Koninklijke Philips Electronics , N.V.
Rachuba M.
Zawilski Peter
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