Customized polish pads for chemical mechanical planarization

Details Customized polish pads for chemical mechanical planarization Customized polish pads for chemical mechanical planarization

2004-03-25

2008-09-16

Rachuba, Maurina (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S008000, C451S056000, C438S690000, C700S097000, C700S117000, C700S121000, C703S006000, C703S007000

Reexamination Certificate

active

07425172

ABSTRACT:
A polishing pad for chemical mechanical planarization of a film on a substrate is customized by obtaining one or more characteristics of a structure on a substrate. For example, when the structure is a chip formed on a semiconductor wafer, the one or more characteristics of the structure can include chip size, pattern density, chip architecture, film material, film topography, and the like. Based on the one or more characteristics of the structure, a value for the one or more chemical or physical properties of the pad is selected. For example, the one or more chemical or physical properties of the pad can include pad material hardness, thickness, surface grooving, pore size, porosity, Youngs modulus, compressibility, asperity, and the like.

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