Customization of integrated circuits

Details Customization of integrated circuits Customization of integrated circuits

1998-09-29

1999-09-14

Picardat, Kevin M.

Semiconductor device manufacturing: process

Repair or restoration

438669, 438671, H01L 2100

Patent

active

059535776

ABSTRACT:
A method for patterning a layer of photoresist includes the steps of 1) exposing the photoresist through a standard precision mask to define all possible cut points, 2) etching all possible cut points in a dielectric layer, 3) selectively exposing a second layer of photoresist with a non-precision targeting energy beam or mask to select the desired cut points. Consequently, no custom precision masks are required to pattern the various layers of photoresist during the fabrication of application specific integrated circuits (ASICs), thereby reducing both the lead-time and costs for manufacturing ASICS.

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