Electricity: electrical systems and devices – Miscellaneous
Patent
1988-02-19
1989-12-19
Kucia, R. R.
Electricity: electrical systems and devices
Miscellaneous
174 685, 361406, 361416, H05K 102
Patent
active
048886653
ABSTRACT:
A customizable circuit using a programmable interconnect and a compatible tape design for tape automated bonding of chips to the circuitry. The programmable interconnect comprises layers of wires, with one layer of wires forming overlap regions with the adjacent layer of wires. The wires can be selectively linked later to form the desired interconnect. The selective linkage represents the customization of an otherwise undedicated interconnect. The TAB chip bonding design uses a carrier tape to bond the integrated circuit chips to the programmable interconnect. Also disclosed is a method for forming the interconnect.
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Kucia R. R.
Microelectronics and Computer Technology Corporation
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