Custom laser conductor linkage for integrated circuits

Details Custom laser conductor linkage for integrated circuits Custom laser conductor linkage for integrated circuits

1996-08-21

1998-08-11

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

257773, 438131, H01L 2900

Patent

active

057930953

ABSTRACT:
An integrated circuit includes a substrate with doped regions, a patterned polysilicon layer defining contacts and local interconnects, a submetal dielectric, a two-metal layer metal interconnect structure with an intermetal dielectric layer, and a passivation layer. Like the dielectric layers, the passivation layer is optically transparent, thick, and planarized. Because of this, laser energy can be directed through the passivation layer to fuse two conductors of the top metal layer without delaminating the passivation layer. In addition, laser energy is directed through the passivation layer and the intermetal dielectric to fuse pairs of conductors in the lower metal layer. Thus, the present invention provides for reliable convenient circuit modification without disturbing dielectric and exposing metal features to moisture and other contaminants.

REFERENCES:
patent: 3766308 (1973-10-01), Loro
patent: 4839700 (1989-06-01), Ramesham et al.
patent: 5373379 (1994-12-01), Nakai
patent: 5512775 (1996-04-01), Cho

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