Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2007-06-12
2007-06-12
Hollington, Jermele (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
Reexamination Certificate
active
10971467
ABSTRACT:
A curved spring structure includes a base section extending parallel to the substrate surface, a curved cantilever section bent away from the substrate surface, and an elongated section extending from the base section along the substrate surface under the cantilevered section. The spring structure includes a spring finger formed from a self-bending material film (e.g., stress-engineered metal, bimorph/bimetallic) that is patterned and released. A cladding layer is then electroplated and/or electroless plated onto the spring finger for strength. The elongated section is formed from plating material deposited simultaneously with cladding layers. To promote the formation of the elongated section, a cementation layer is provided under the spring finger to facilitate electroplating, or the substrate surface is pre-treated to facilitate electroless plating.
REFERENCES:
patent: 3842189 (1974-10-01), Southgate
patent: 3952404 (1976-04-01), Matunami
patent: 4189342 (1980-02-01), Kock
patent: 4423401 (1983-12-01), Mueller
patent: 4468014 (1984-08-01), Strong
patent: 4821148 (1989-04-01), Kobayashi et al.
patent: 5280139 (1994-01-01), Suppelsa et al.
patent: 5399232 (1995-03-01), Albrecht et al.
patent: 5414298 (1995-05-01), Grube et al.
patent: 5465611 (1995-11-01), Ruf et al.
patent: 5513518 (1996-05-01), Lindsay
patent: 5515719 (1996-05-01), Lindsay
patent: 5534662 (1996-07-01), Peacock et al.
patent: 5612491 (1997-03-01), Lindsay
patent: 5613861 (1997-03-01), Smith et al.
patent: 5665648 (1997-09-01), Little
patent: 5780885 (1998-07-01), Diem et al.
patent: 5831181 (1998-11-01), Majumdar et al.
patent: 5848685 (1998-12-01), Smith et al.
patent: 5914218 (1999-06-01), Smith et al.
patent: 5939623 (1999-08-01), Muramatsu et al.
patent: 5944537 (1999-08-01), Smith et al.
patent: 5959516 (1999-09-01), Chang et al.
patent: 5960147 (1999-09-01), Muramatsu et al.
patent: 5979892 (1999-11-01), Smith
patent: 6011261 (2000-01-01), Ikeda et al.
patent: 6117694 (2000-09-01), Smith et al.
patent: 6184065 (2001-02-01), Smith et al.
patent: 6184699 (2001-02-01), Smith et al.
patent: 6194774 (2001-02-01), Cheon
patent: 6213789 (2001-04-01), Chua et al.
patent: 6249039 (2001-06-01), Harvey et al.
patent: 6252175 (2001-06-01), Khandros
patent: 6264477 (2001-07-01), Smith et al.
patent: 6290510 (2001-09-01), Fork et al.
patent: 6299462 (2001-10-01), Biegelsen
patent: 6352454 (2002-03-01), Kim et al.
patent: 6392524 (2002-05-01), Biegelsen et al.
patent: 6441359 (2002-08-01), Cozier et al.
patent: 6455885 (2002-09-01), Lin
patent: 6499216 (2002-12-01), Fjelstad
patent: 6505398 (2003-01-01), Park
patent: 6528350 (2003-03-01), Fork
patent: 6528785 (2003-03-01), Nakayama et al.
patent: 6556648 (2003-04-01), Bal et al.
patent: 6578410 (2003-06-01), Israelachvili
patent: 6815961 (2004-11-01), Mok et al.
patent: 6956389 (2005-10-01), Mai
patent: 7048548 (2006-05-01), Mathieu et al.
patent: 2002/0013070 (2002-01-01), Fork et al.
patent: 2002/0040884 (2002-04-01), Hantschel et al.
patent: 2002/0047091 (2002-04-01), Hantschel et al.
patent: 2002/0055282 (2002-05-01), Eldridge et al.
patent: 2002/0079445 (2002-06-01), Hantschel et al.
patent: 2002/0164893 (2002-11-01), Mathieu et al.
patent: 2003/0010615 (2003-01-01), Fork et al.
patent: 2006/0105122 (2006-05-01), Hantschel et al.
patent: WO 99/18445 (1999-04-01), None
patent: WO 00/33089 (2000-06-01), None
patent: WO 01/48870 (2001-07-01), None
Zou et al. “Plastic Deformation Magnetic Assembly (PDMA) of Out-of-Plane Microstrutures: Technology and Application,” IEEE Journal of Microelectromechanical Systems, vol. 10, No. 2, Jun. 2001, pp. 302-309.
Chen et al. “Nanostructure patterns written in polycarbonate by a bent optical fiber probe,” J. Vac. Sci. Technol. B 19(6), Nov./Dec. 2001, pp. 2299-2300.
Kim et al. “Realization of High-Q Inductors Using Wirebonding Technology,” School of Electronics Engineering, Ajou University, Korea, 4 pgs, Aug. 1990.
Datta, Madhav “Microfabrication by electrochemical metal removal,” IBM J. Res. Develop. vol. 42, No. 5, Sep. 1998, pp. 655-669.
Larson, Lawrence E., ed.RF and Microwave Circuit Design for Wireless Communications,Artech House: Boston 1997, 8 pgs.
Zhang et al. “A MEMS nanoplotter with high-density parallel dip-pen nanolithography probe arrays,” IOP Publishing, Nanotechnology 13 (2002), pp. 212-217.
Craninckx et al. “A CMOS 1.8GHz Low-Phase-Noise-Voltage-Controlled Oscillator with Prescaler,” 1995 IEEE International Solid-State Circuits Conference, Digest of Technical Papers, pp. 266-268.
Rogner et al. “The LIGA technique-what are the new opportunities,” J. Micromech. Microeng. 2 (1992), pp. 133-140.
Young et al. “Monolithic High-Performance Three-Dimensional Coil Inductors for Wireless Communication Applications,” pp. 3.5.1-3.5.4.
Young et al. “A Low-Noise RF Voltage-Controlled Oscillator Using On-Chip High-Q Three-Dimensional Coil Inductor and Micromachined Variable Capacitor,” pp. 128-131.
Nguyen et al. “Si IC-Compatible Inductors and LC Passive Filters,” IEEE Journal of Solid-State Circuits, vol. 25, No. 4, Aug. 1990, pp. 1028-1031.
Chang et al. “Large Suspended Inductors on Silicon and Their Use in a 2-μm CMOS RF Amplifier,” IEEE Electron Device Letters, vol. 14, No. 5, May 1993, pp. 246-248.
Nguyen et al. “A 1.8-GHz Monolithic LC Voltage-Controlled Oscillator,” IEEE Journal of Solid-State Circuits, vol. 27, No. 3, Mar. 1992, pp. 444-450.
Chow Eugene M.
Hantschel Thomas
Bever Patrick T.
Bever Hoffman & Harms LLP
Hollington Jermele
Nguyen Trung Q.
Palo Alto Research Center Incorporated
LandOfFree
Curved spring structure with elongated section located under... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Curved spring structure with elongated section located under..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Curved spring structure with elongated section located under... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3858318