Curved lead configurations

Details Curved lead configurations Curved lead configurations

1997-09-12

1999-01-12

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With means for controlling lead tension

257666, 257690, 257642, 257773, H01L 2348, H01L 2906

Patent

active

058594728

ABSTRACT:
A microelectronic assembly includes first and second microelectronic elements having confronting surfaces that are spaced apart from one another. Vertically extensive flexible lead elements interconnect electrical connections on the microelectronic elements. Each of the flexible lead elements may include a plurality of curved conductors that are electrically connected and parallel to one another. The lead elements may initially be formed on a lead bearing surface, and have a terminal end for connection to the first microelectronic element, and a tip end for connection to the second microelectronic element. The terminal end is disposed on the lead bearing surface and fixed to it, while the tip end is releasably connected to the lead bearing surface, and spaced apart from the terminal end on an offset axis. Curved leads interconnect the tip end and the terminal end.

REFERENCES:
patent: 3795037 (1974-03-01), Luttmer
patent: 4893172 (1990-01-01), Matsumoto et al.
patent: 5518964 (1996-05-01), Distefano et al.
patent: 5682061 (1997-10-01), Khandros et al.
patent: 5763941 (1998-06-01), Fjelstad

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