Current test probe having a solder guide portion, and...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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Details

C324S754030

Reexamination Certificate

active

07888958

ABSTRACT:
A probe for current test is provided. The probe includes a probe body having a plate-like connection portion whose end face becomes a connection face to a probe board, a solder layer formed on at least one side face of said connection portion, and a guide portion formed on the connection portion. The guide portion penetrates the connection portion in its thickness direction from the one side face with the solder layer formed to the other side face. When the solder layer is melted, the guide portion guides a portion of the melted solder to the other side face.

REFERENCES:
patent: 5453017 (1995-09-01), Belopolsky
patent: 2002/0060580 (2002-05-01), Yamabe
patent: 2002/0061668 (2002-05-01), Fujimura
patent: 2002/0146920 (2002-10-01), Sugiyama
patent: 2005-055194 (2002-03-01), None
patent: 2002-158264 (2002-05-01), None
patent: 2002-164104 (2002-06-01), None
patent: 2002-283049 (2002-10-01), None
Pat. Abstract of JP (2002-164104), Jun. 7, 2002, Ando Electric Co. Ltd.
Pat. Abstract of JP (2002-283049), Oct. 2, 2002, Ando Electric Co. Ltd.
Pat. Abstract of JP (2002-158264), May 31, 2002, Ando Electric Co. Ltd.
Pat. Abstract of JP (2005-055194), Mar. 3, 2002, Japan Electronic Materials Corp.

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