Curing resin composition and sealants and end-sealing...

Details Curing resin composition and sealants and end-sealing... Curing resin composition and sealants and end-sealing...

2007-08-07

2007-08-07

Berman, Susan (Department: 1711)

Catalyst, solid sorbent, or support therefor: product or process

Irradiation by, or application of, electrical, magnetic or...

C502S159000, C502S167000, C502S172000

Reexamination Certificate

active

10477838

ABSTRACT:
The invention provides a curing resin composition to be used for a sealant or an end-sealing material for a display element, which comprises a curing resin together with a photopolymerization initiator and/or a curing agent and, has a carbonyl group derived from a (meth)acryl group together with an epoxy group and/or a hydroxyl group derived from an epoxy group and, a cured product of which has nitrogen atoms at a ratio of 3 to 10% by atom in the total of carbon atoms, hydrogen atoms and nitrogen atoms in the composition; a volume resistance of 1×1013Ω·cm or higher; a dielectric constant of 3 or higher at 100 kHz; and a glass transition temperature of 80 to 150° C.

REFERENCES:
patent: 4922004 (1990-05-01), Kohler et al.
patent: 4977293 (1990-12-01), Hatton et al.
patent: 5100987 (1992-03-01), Hatton et al.
patent: 5232883 (1993-08-01), Derleth et al.
patent: 5346958 (1994-09-01), Yukawa et al.
patent: 5510307 (1996-04-01), Narayanan et al.
patent: 6106914 (2000-08-01), Kanbe et al.
patent: 6110993 (2000-08-01), Saito et al.
patent: 6231751 (2001-05-01), Canos et al.
patent: 2003/0147034 (2003-08-01), Kojima
patent: 2006/0073334 (2006-04-01), Schwantes et al.
patent: 0 798 312 (1997-10-01), None
patent: 2 272 906 (1994-06-01), None
patent: 58-173118 (1983-10-01), None
patent: S59-59720 (1984-04-01), None
patent: S62-146915 (1987-06-01), None
patent: S63-265221 (1988-11-01), None
patent: 64-070440 (1989-03-01), None
patent: H1-243029 (1989-09-01), None
patent: H2-292325 (1990-12-01), None
patent: 05-214310 (1993-08-01), None
patent: H5-295087 (1993-11-01), None
patent: H6-160872 (1994-06-01), None
patent: H6-227811 (1994-08-01), None
patent: H6-287198 (1994-10-01), None
patent: H7-13173 (1995-01-01), None
patent: H7-13174 (1995-01-01), None
patent: H7-13175 (1995-01-01), None
patent: H7-56178 (1995-03-01), None
patent: 09-005759 (1997-01-01), None
patent: 09-087364 (1997-03-01), None
patent: H11-109384 (1999-04-01), None
patent: 2000-66220 (2000-03-01), None
patent: 2000-219868 (2000-08-01), None
patent: 2000-338505 (2000-12-01), None
patent: 2001-100224 (2001-04-01), None
patent: 2001-133794 (2001-05-01), None

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