Curing epoxy resins using dicy, imidazole and acid

Details Curing epoxy resins using dicy, imidazole and acid Curing epoxy resins using dicy, imidazole and acid

1994-11-17

1996-04-16

Krass, Frederick

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

528 88, 528 89, 528 90, 528 91, 528 93, 528 94, 528407, 525504, C08L 6300

Patent

active

055083285

ABSTRACT:
A curable epoxide composition consists essentially of curable epoxides, dicyandiamide as a curing agent in an amount less than needed to fully cure the epoxides, an imidazole in an amount exceeding that needed as a catalyst and capable of curing the epoxides in combination with the dicyandiamide, a reactivity controller for the imidazole to reduce the curing speed, and a solvent. The use of undesirable solvents such as DMF is reduced. A glass transition temperature greater than 135.degree. C. is obtained in the cured composition and is maximized by balancing the amounts of dicyandiamide, the imidazole, and the reactivity controller.

REFERENCES:
patent: 3356645 (1967-12-01), Warren
patent: 3438937 (1969-04-01), Christie
patent: 3631150 (1971-12-01), Green
patent: 3635894 (1972-01-01), Dowbenko et al.
patent: 3677978 (1972-07-01), Dowbenko et al.
patent: 4452847 (1984-06-01), Siemon
patent: 5169473 (1992-12-01), Bertram et al.
patent: 5308895 (1994-05-01), Gan et al.

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