Curing device

Details Curing device Curing device

1992-10-13

1993-12-07

Tapolcai, William E.

Heating

Advancing structure flexing, looping or coiling sheet, web...

198817, 414157, F27B 928

Patent

active

052678539

ABSTRACT:
A curing device, which hardens on heater blocks a paste used for die-bonding the chips to lead frames, including frame supporting wires, wire slacking preventing collars and frame conveying wires. The frame supporting wires are installed above the heater blocks and parallel to the feeding direction of the lead frames, and the wire slacking preventing collars are mounted on the frame supporting wires so that a constant space is retained between the frame supporting wires and the heater blocks. The lead frames are fed and placed on the frame supporting wires when the frame conveying wires, which are movable vertically, is moved down, so that the pastes is heated by the heater blocks.

REFERENCES:
patent: 4217090 (1980-08-01), White et al.
patent: 4217977 (1980-08-01), Tam
patent: 4507078 (1985-03-01), Tam et al.
patent: 4591044 (1986-05-01), Ogami et al.
patent: 4874081 (1989-10-01), Kondo
patent: 5067608 (1991-11-01), McLellan
patent: 5168978 (1992-12-01), Cox et al.

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