Curing device

Details Curing device Curing device

1995-11-21

1997-08-05

Kamen, Noah P.

Heating

Work chamber having heating means

Having means by which work is progressed or moved mechanically

414156, 1987501, F27B 900

Patent

active

056535864

ABSTRACT:
A curing device for drying bonding material used for bonding, for example, chips to a lead frame for semiconductor devices including reciprocatory motion drive pulleys provided on the drive shafts of a conveyor. A plurality of wire ropes are installed on the pulleys, and end fittings are attached to the ropes so as to be fitted to the reciprocatory motion drive pulleys. Thus, the positional relationship between the wire ropes and the reciprocatory motion drive pulleys are not changed, and the workpieces are correctly carried by the wire ropes onto heating blocks of the curing device.

REFERENCES:
patent: 4591044 (1986-05-01), Ogami et al.
patent: 5154604 (1992-10-01), Arai
patent: 5267853 (1993-12-01), Arai

Affiliated with

Also associated with

Rating

Curing device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Curing device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Curing device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1070517