Curing agents for epoxy resins comprising bis(aminomethyl)bicycl

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

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525526, 528111, 528122, 564306, C08G 5918, C08G 5950

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active

056313322

ABSTRACT:
A curing agent for epoxy resins, prepared by reacting 2,5- and 2,6-bis(aminomethyl)-bicyclo[2.2.1]heptanes (1 equivalent of the active hydrogen in the amino group) with an epoxy resin (a reaction product of bisphenols or a novolak resin with epichlorohydrin; an epoxy equivalent of 150-300 g/eq.; two or more epoxy groups per molecule; bisphenol-A diglycidyl ether or bisphenol-F diglycidyl ether in particular)(0.025-0.50 equivalents of the epoxy group). The reaction temperature is 40.degree.-120.degree. C. The amount of the curing agent is within the range of 20-75 parts by weight relative to 100 parts by weight of an epoxy resin to be cured. The curing agent has a high curing rate at a room temperature, and the epoxy resins cured by it have a good appearance as well as excellent adhesion, water resistance, and chemical resistance. Therefore, the curing agent is suitable for paints, civil engineering and construction materials, adhesives, casting resins, laminates, etc.

REFERENCES:
patent: 3595917 (1971-07-01), Trecker et al.
patent: 3629181 (1971-12-01), Heer et al.
patent: 5087722 (1992-02-01), Inomata et al.
Database WPI, Week 9217, Derwent Publications Ltd., London, GB; AN 92-138016 XP 002007039 & JP-A-04080228 (Mitsui Toatsu Chemicals, Inc.), Mar. 13, 1992 *Abstract*.
Database WPI, Week 7908, Derwent Publications Ltd., London, GB; AN 79-14693 XP002007040 & JP-A-54004992 (Japan Geon KK), Jan. 16, 1979 *Abstract*.
Database WPI, Week 9337, Derwent Publications Ltd., London, GB; AN 93-290563 XP002007041 & JP-A-05171127 (Mitsui Toatsu Chemicals, Inc.), Jul. 9, 1993 *Abstract*.
B. Ellis, Editor, "Chemistry and Technology of Epoxy Resins", 1993, Blackie Academic & Professional, London, GB XP002007038, pp. 42, 43 and 53.

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