Curing agent, preparation thereof and curable composition compri

Organic compounds -- part of the class 532-570 series – Organic compounds – Silicon containing

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556437, 556440, 556445, 556451, C07F 708

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active

055678335

ABSTRACT:
A curable composition which comprises
(C) a non-polymeric organic curing agent having at least two hydrosilyl groups in a molecule,
(D) an organic polymer having at least one alkenyl group in a molecule, and
(E) a hydrosilylation catalyst
has rapid curability and good depth curability, and gives a homogeneous cured material having good mechanical properties.

REFERENCES:
patent: 4895967 (1990-01-01), Crivello et al.
patent: 5189193 (1993-02-01), Freeburne et al.
patent: 5194649 (1993-03-01), Okawa
patent: 5241097 (1993-08-01), Zupancic et al.
patent: 5256754 (1993-10-01), Takarada et al.
patent: 5272243 (1993-12-01), Nakashima et al.

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