Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...
Patent
1985-11-13
1987-12-08
Nielsen, Earl
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Mixing of two or more solid polymers; mixing of solid...
536103, 525511, 528 48, 528 88, 528365, 528407, C08G 5968
Patent
active
047119365
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
The present invention relates to a curing agent for an epoxy resin, which is chemically stable at room temperature, prepared by forming a cyclodextrin clathrate compound of a compound which is reactive with an epoxy group, and a method for curing an epoxy resin using said curing agent.
An epoxy resin which is liquid or thermoplastic at room temperature can be converted into a thermosetting solid by reaction with a compound which is reactive with an epoxy group (a curing agent for an epoxy resin). Curing of an epoxy resin for applications is therefore effected in such a manner that an uncured epoxy resin and a curing agent are separately stored until they are mixed at the time of application.
Primary and secondary amines, amine complex compounds, organic acids and anhydrides thereof, alcohols, phenols, and the like have been used conventionally as the curing agent for an epoxy resin. These curing agents have, however, disadvantages from the viewpoints of treatment or operation because many of them are chemically unstable, volatile, highly toxic to human bodies, or difficult to homogeneously mix or disperse in an epoxy resin (see Japanese Patent Publications No. 9838/1975, No. 27760/1978, and No. 47837/1975).
SUMMARY OF THE INVENTION
The present invention has been developed with the aim of providing a curing agent for an epoxy resin, which is chemically stable at room temperature, prepared by forming a cyclodextrin clathrate compound of a compound which is reactive with an epoxy group; a method for curing an epoxy resin by incorporating and dispersing said curing agent in an epoxy resin and heating the mixture at a temperature of 90.degree. C. or higher, whereby said cyclodextrin clathrate compound is decomposed and the curing reaction of the epoxy resin is initiated a curing agent for an epoxy resin obtained by adding a trace amount of amylase to the curing agent for an epoxy resin described above; and a method for curing an epoxy resin by heating said curing agent at a temperature of 30.degree. C. or higher, whereby cyclodextrin is decomposed by said amylase and the curing reaction of the epoxy resin is initiated.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Examples of the substances which are reactive with an epoxy resin are listed below.
(a) Ethylenediamine
(b) Diethylenetriamine
(c) Diethylaminopropylamine ##STR1##
(d) N-aminoethylpiperazine ##STR2## [2] Internal amine adduct, Separated adduct
(a) Amine adduct ##STR3##
(b) Amine ethyleneoxide adduct ##STR4##
(c) Cyanoethyl compound ##STR5## [3] Polyamide resin ##STR6## [4] Aromatic amine
(a) Metaphenylenediamine ##STR7##
(b) Diaminodiphenylmethane ##STR8##
(c) Diaminodiphenylsulfone ##STR9## [5] Amine precondensation compound Etpoxy amine adduct ##STR10## [6] Amine complex
(a) Dicyanodiamide ##STR11##
(b) Heterocyclic amine ##STR12##
(c) Xylylenediamine ##STR13##
(d) Piperazine
(e) Pyridine
(f) Imidazole
(g) N-aminoethylpiperazine
(h) Menthanediamine ##STR14##
(i) Trimethylamine ##STR15##
(j) Benzyldimethylamine ##STR16##
(k) .alpha.-methylbenzyldimethylamine ##STR17##
(l) Dimethylaminomethylphenol ##STR18##
(m) Tridimethylaminomethylphenol ##STR19## [7] Amine salt, Amine complex salt
(a) Tridimethylaminomethylphenol-tri-2-ethylhexanoate ##STR20##
(b) Borontrifluoridemonoethylamine complex ##STR21##
(c) Borontrifluoride.amine complex salt ##STR22## [8] Organic acid, Organic acid anhydride
(a) Phthalic anhydride ##STR23##
(b) Hexahydrophthalic anhydride ##STR24##
(c) Maleic anhydride ##STR25##
(d) Pyromellitic dianhydride ##STR26##
(e) Benzophenonetetracarboxylic dianhydride ##STR27##
(f) Methylnadic anhydride ##STR28##
(g) Dodecysuccinic anhydride ##STR29##
(h) Chlorendic anhydride ##STR30##
(i) Dichloromaleic anhydride ##STR31## [9] Precondensation of organic anhydride ##STR32## [10] Urea resin [11] Melamine resin ##STR33## [13] Polyhydric phenol
(a) Bisphenol A ##STR34##
(b) Trimethylolaryloxyphenol ##STR35## [14] Phenol resin ##STR36## [15] Epoxydibutylphenol resin ##STR37## [16] Epoxy resin ester [17] Modifie
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patent: 3420788 (1969-01-01), Solms
patent: 4228160 (1980-10-01), Szejtli et al.
patent: 4365061 (1982-12-01), Szejtli et al.
patent: 4380626 (1983-04-01), Szejtli et al.
patent: 4518588 (1985-05-01), Szejtli et al.
patent: 4575548 (1986-03-01), Ueda et al.
Nakamura Kenji
Shibanai Ichiro
Japan Liquid Crystal Co., Ltd.
Nielsen Earl
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