Curing agent composition for epoxy resin

Details Curing agent composition for epoxy resin Curing agent composition for epoxy resin

2007-06-05

2007-06-05

Feely, Michael J. (Department: 1712)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C525S471000, C528S106000, C528S119000, C528S220000, C528S228000, C528S229000

Reexamination Certificate

active

10846599

ABSTRACT:
An epoxy resin curing agent composition containing a ketimine compound prepared by the reaction between a polyoxypropylenediamine component and a ketone compound, wherein (1) the polyoxypropylenediamine component is a 9/1 to 6/4 (by weight) mixture of polyoxypropylenediamine having a molecular weight of 200 and 500 and polyoxypropylenediamine having a molecular weight of 1000 to 3000, (2) the ketimine compound has a degree of ketimination of 90% or higher, or (3) the reaction is carried out in the presence of a catalyst selected from (i) a combination of a tertiary amine and a sulfonic acid and (ii) a salt between a tertiary amine and a sulfonic acid.

REFERENCES:
patent: 05-132541 (1993-05-01), None
patent: 05-271389 (1993-10-01), None
patent: 63-273629 (1998-11-01), None
patent: 63-273630 (1998-11-01), None
Machine translation of JP 05-271389, provided by the JPO website.
Machine translation of JP 05-132541, provided by the JPO website.

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