Curing accelerator, epoxy resin composition, and...

Catalyst – solid sorbent – or support therefor: product or process – Catalyst or precursor therefor – Organic compound containing

Reexamination Certificate

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C528S089000, C568S011000

Reexamination Certificate

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07074738

ABSTRACT:
A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reliability are provided. The epoxy resin composition includes a compound (A) having two or more epoxy groups in one molecule, a compound (B) having two or more phenolic hydroxyl groups in one molecule, trisubstituted phosphoniophenolate or a salt thereof as a curing accelerator (C), and an inorganic filler (D).

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