Cure of epoxy systems at reduced pressures

Details Cure of epoxy systems at reduced pressures Cure of epoxy systems at reduced pressures

1981-09-17

1983-02-15

Lowe, James B.

Plastic and nonmetallic article shaping or treating: processes

Vacuum treatment of work

To degas or prevent gas entrapment

26427213, 26433112, 264DIG42, 264DIG78, 5281113, 528119, B29B 300, B29C 600

Patent

active

043740812

ABSTRACT:
Epoxide compounds can be cured without resorting to the usual elevated temperatures by reducing the ambient pressure to 4.79 Pa or lower. This is particularly useful in potting circuitry.

REFERENCES:
patent: 2803054 (1957-08-01), Kohring
patent: 3608023 (1971-09-01), Scarborough
patent: 4289722 (1981-09-01), Tranburger
"Improving Insulation Resistance of Dielectrics", Washo, IBM Technical Disclosure Bulletin, vol. 15, No. 3, Aug. 72.
"Improving the Strength of Plastics by Vacuum Molding", Mustafaen et al, Polym. Mech. vol. 2, No. 5, Sep./Oct. 1966, pp. 448-452.

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