Coating processes – Direct application of electrical – magnetic – wave – or... – Polymerization of coating utilizing direct application of...
Reexamination Certificate
2000-05-26
2002-01-01
Pianalto, Bernard (Department: 1762)
Coating processes
Direct application of electrical, magnetic, wave, or...
Polymerization of coating utilizing direct application of...
C427S391000, C427S393000, C427S395000, C427S397000, C427S551000, C427S595000, C522S072000
Reexamination Certificate
active
06335060
ABSTRACT:
BACKGROUND OF THE INVENTION
Technical Field
The present invention relates to an electron-beam-curable treating agent, an electron beam curing treatment process, a heat-radical-curable resin composition, a heat-radical-curable treating agent, and a heat-radical-curing treatment process for modification, for example, enhancement of the heat resistance, of cellulosic materials such as wood plates, dressing paper, laminated plywood, wood chips, cellulose fibers, and paper.
Background Art
Wood plates (which might be called veneers) or dressing paper is laminated onto surfaces of substrates, such as plywood, metal plates, and glass plates, for the purpose of giving a feeling of quality to the surfaces of the substrates in furniture for home or office use, or in interior decoration materials for buildings. In addition, a treatment is carried out for the purpose of increasing the surface hardness of the above surface-dressing materials (such as wood plates and dressing paper) and enhancing their properties such as moisture resistance, water resistance, and heat resistance. In this treatment, the surface-dressing materials are impregnated with a treating agent and then laminated onto substrates, and then the above treating agent is cured, or the above treating agent is impregnated into the surface-dressing materials and then cured in that state.
Also in the field of particle boards or fiber boards used as building materials and so on, the above treating agent is impregnated into wood chips or cellulose fibers (which are components of the particle boards or fiber boards) and then cured in order to enhance properties, such as moisture resistance, water resistance, and heat resistance, of the wood chips or cellulose fibers.
As to the above treating agent, those which include unsaturated polyester resins, vinyl ester resins, urethane (meth)acrylate resins, urea resins, or melamine resins are used as typical ones. Especially recently, studies are carried out to enhance the aforementioned properties by using resin compositions which contain specific resin components as essential components (JP-A-10-158471) or by impregnating specific monomer components into wood (JP-A-11-114914).
However, it is difficult to say that the conventional treating agents sufficiently satisfy all the above demanded properties, namely, heat resistance, water resistance, surface physical properties (e.g. surface hardness), moisture resistance, and impregnability.
For example, JP-A-10-158471 discloses a curable resin composition comprising an amino resin and a specific vinyl ester compound, but this resin composition does not exhibit sufficient performance in respect to the water resistance, because this resin composition contains the amino resin as an essential component.
In addition, JP-A-11-114914 discloses a treatment process comprising the steps of impregnating a specific hydrophilic vinyl monomer into wood and then curing the monomer, but this treatment process is not on a satisfactory level with regard to surface physical properties (e.g. surface hardness) or surface material feel.
In addition, in treatment processes involving the use of the aforementioned treating agents, materials to be treated are, for example, passed through heating furnaces to thermoset the treating agents. Therefore, it is impossible to say that the productivity is sufficient.
SUMMARY OF THE INVENTION
OBJECT OF THE INVENTION
An object of the present invention is to provide a curable treating agent and a curing treatment process which provide excellent results with regard to any of heat resistance, water resistance, surface physical properties, and impregnability, and further, involve high productivity.
DISCLOSURE OF THE INVENTION
To solve the above problems, the present inventor studied about (i) excellent curable treating agents and curing treatment processes other than conventional thermosetting types and (ii) excellent curable treating agents and curing treatment processes in conventional thermosetting types.
Specifically, the inventor diligently studied first about electron beam curing as (i) above.
Electron beam curing is known as a curing process which is applicable to radical polymerization. This curing process enables the irradiation of very high energy and therefore completes curing in a short time. On the other hand, in cases where cellulosic substrates typified by wood are modified, what has a hydrophilic functional group is preferable as the above treating agent, and examples of those which can be cured with the above electron beam include HEMA (2-hydroxyethyl methacrylate) and HEA (2-hydroxyethyl acrylate). However, they have demerits as follows. The HEMA does not have sufficient curability with electron beams although it has a high effect upon the surface hardness enhancement. On the other hand, the HEA is inferior with regard to the surface hardness enhancement effect and the heat resistance enhancement effect although it has high curability with electron beams. Thus, the inventor studied about excellent electron-beam-curable treating agents and electron beam curing treatment processes which do not have the above demerits and, from this study, the inventor came up with an idea about an electron-beam-curable treating agent comprising a specific amount of high boiling point resin and, as a result, completed the present invention by finding that the above problems can be solved by an electron-beam-curable treating agent which involves the use of a large amount of radical-polymerizable component as a high boiling point resin component and includes a compound of general formula (1) below as this high boiling point radical-polymerizable component, and further that the above problems can be solved if a treating agent including a compound of general formula (1) below is used and if electron beam irradiation conditions are specified.
In addition, from the study about (ii) above, the inventor found that all the above problems can be solved by a resin composition comprising a radical-polymerizable component in a specific ratio wherein the radical-polymerizable component includes a specific heat-radical-polymerizable compound and a specific resin in specific ratios respectively wherein the specific resin has a polymerizable unsaturated double bond which is directly linked to an ester bond. As a result, the inventor completed the present invention.
Incidentally, general formula (1) is:
wherein:
R
1
is a hydrogen atom, an alkyl group with 1~18 carbon atoms, a cycloalkyl group with 3~10 carbon atoms, an aryl group, a hydroxyalkyl group with 1~8 carbon atoms, a —(CH
2
)
m
NR
2
R
3
group, or a —(C
2
H
4
O)
n
R
4
group, wherein: R
2
and R
3
are linear or branched alkyl groups with 1~8 carbon atoms; is a linear or branched alkyl group with 1~18 carbon atoms; m is an integer of 2~5; and n is an integer of 1~80;
R
5
is a hydrogen atom, an alkyl group with 1~12 carbon atoms, a cycloalkyl group with 3~10 carbon atoms, an aryl group, a hydroxyalkyl group with 1~12 carbon atoms, or an oxirane group with 2~8 carbon atoms; and
R
6
is a hydrogen atom,
wherein:
R
7
is a hydrogen atom or organic residue;
n is an integer of 1~3; and
m is an integer of 1~100,
wherein:
each of R
8
and R
9
is independently a hydrogen atom or organic residue;
n is an integer of 0~5; and
m is an integer of 1~100, or
wherein:
R
10
is a hydrogen atom, an alkyl group with 1~6 carbon atoms, a cycloalkyl group with 3~8 carbon atoms, or an aryl group with 6~18 carbon atoms; and
R
11
is an alkyl group with 1~18 carbon atoms, a cycloalkyl group with 3~8 carbon atoms, an aryl group with 6~18 carbon atoms, or
a —(CHR
12
CH
2
O)
m
R
13
group, wherein: R
12
is a hydrogen atom or a methyl group; R
13
is a hydrogen atom, an alkyl group with 1~6 carbon atoms, a cycloalkyl group with 3~8 carbon atoms, or an aryl group with 6~18 carbon atoms; and m is an integer of 1~4.
That is to say, an electron-beam-curable treating agent, according to the present invention, comprises a high boiling point resin in a ratio of not lower than 10 weight % and is used for a
Nippon Shokubai Co. , Ltd.
Pianalto Bernard
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