Curable slurry for forming ceramic microstructures on a...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Compositions to be polymerized by wave energy wherein said...

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C522S031000, C522S048000, C522S068000, C522S083000, C524S386000, C524S388000, C524S442000, C524S492000, C524S497000, C106S280000, C106S281100, C106S287100, C106S287160, C106S287290

Reissue Patent

active

RE040967

ABSTRACT:
A curable slurry for forming ceramic microstructures on a substrate using a mold. The slurry is a mixture of a ceramic powder, a fugitive binder, and a diluent. The ceramic powder has a low softening temperature in a range of about 400° C. to 600° C. and a coefficient of thermal expansion closely matched to that of the substrate. The fugitive binder is capable of radiation curing, electron beam curing, or thermal curing. The diluent promotes release properties with the mold after curing the binder or quick and complete burn out of the binder during debinding.

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