Curable silicone resin composition, sealing material for...

Details Curable silicone resin composition, sealing material for... Curable silicone resin composition, sealing material for...

2008-01-29

2008-01-29

Zimmer, Marc S. (Department: 1712)

Stock material or miscellaneous articles

Composite

Of silicon containing

C525S477000, C525S478000, C528S015000, C528S031000, C528S032000, C524S099000, C524S323000, C524S351000, C524S588000

Reexamination Certificate

active

11087599

ABSTRACT:
Provided is a curable silicone resin composition including (A) a siloxane-based compound containing at least 2 addition reactive carbon-carbon double bonds within each molecule, (B) a siloxane-based compound containing at least 2 hydrogen atoms bonded to silicon atoms within each molecule, (C) a hydrosilylation reaction catalyst, (D) a phenol-based antioxidant, and (E) a hindered amine compound. Also provided are an optical semiconductor sealing material including such a composition, and an optical semiconductor device that has been sealed with such a composition. The curable silicone composition generates a cured product with high hardness and strength, excellent transparency, and excellent light transmittance and photostability particularly in the short wavelength region.

REFERENCES:
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patent: 6815076 (2004-11-01), Aoki
patent: 2004/0157064 (2004-08-01), Aoki
patent: 2004/0214966 (2004-10-01), Tabei et al.
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patent: 2005/0038221 (2005-02-01), Tabei et al.
patent: 2005/0061437 (2005-03-01), Goto et al.
patent: 2005/0080154 (2005-04-01), Tabei
patent: 10-228249 (1998-08-01), None
patent: 2004-190013 (2004-07-01), None
Examination Report issued by the Intellectual Property Office of New Zealand for corresponding Patent Application No. 535587.

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