Curable resin compound, method for producing the same, and cured

Organic compounds -- part of the class 532-570 series – Organic compounds – Oxygen containing

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549554, 526285, 526316, 528125, C08F13800, C07C 4984, C07C 49796

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active

058640509

ABSTRACT:
The present invention provides a curable resin compound which is soluble in organic solvents and easy to use, and a method for producing the same. The curable resin compound comprises a structure and crosslinkable groups which end-cap the structure, the structure comprising three or four non-substituted benzene rings each of which is joined with each adjacent benzene ring by an ether or ketone linkage so that both types of linkages are present in the structure. Though the curable resin compound exhibits satisfactory solubilities in organic solvents, a composition comprising the compound can be cured by a crosslinking reaction to be insoluble in the organic solvents while being provided with improved solvent resistance and chemical resistance. Accordingly, the present invention also provides a cured-resin material derived from the aforementioned curable resin compound, the cured-resin material being excellent in solvent resistance, chemical resistance and thermal resistance.

REFERENCES:
patent: 4234712 (1980-11-01), Keller
Synthesis and Characterization of Soluble, High Molecular Weight Poly (aromatic diacetylenes), Inventors, Kwock, et al., American Chemical Society, 1993, pp. 2935-2940.
"Acetylene-terminated ether-ketone oligomers", Inventors, F. Martinez Nunez, et al., Polymer, 1992, vol. 33, No. 15, pp. 3286-3291.
Sachdeva "Toughening of AT-Resms" Journal of Adhesm vol. 32 pp. 15-28; 1990.
Loughran "Thermal and Thermal Mechanical Properties of Acetylene Terminated Phenylene Systems" Organic Coatings Plastics vol. 43 pp. 777-782; 1980.

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