Curable resin composition for overcoat of flexible circuit

Details Curable resin composition for overcoat of flexible circuit Curable resin composition for overcoat of flexible circuit

1998-08-10

2000-12-19

Gorr, Rachel

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From reactant having at least one -n=c=x group as well as...

528 60, 528 65, 528 45, 528 85, 525124, C08G 1880

Patent

active

061628891

ABSTRACT:
Herein is desclosed a curable resin composition comprising at least one polyol selected from the group consisting of Polyol A, including polybutadiene polyol (Polyol Aa), Polyol B, including polybutadiene polyol (Polyol Ba) and polyester polyol (Polyol Bb), and Polyol C, and at least one polyblock isocyanate selected form the group consisting of polyblock isocyanate (Isocyanate X), including polybutadiene polyblock isocyanate (Isocyanate Xa), which is excellent in warp property, i.e., provides a low shrinkage, upon curing, and the cured products of which are particularly excellent in flexibility and excellent in such properties chemical resistance, heat resistance, electric insulation, bending resistance and adherence, and which is, therefore, suitable for overcoat of flexible circuit.

REFERENCES:
patent: 4267299 (1981-05-01), Oechsle et al.
patent: 4410667 (1983-10-01), Porter et al.
patent: 5126479 (1992-06-01), Duenwald et al.
Patent Abstracts of Japan, vol. 005, No. 089 (C-058), Jun. 10, 1981, JP 56 032559, Apr. 2, 1981.
Derwent Abstracts, AN 87-132590, JP 62 072749, Apr. 3, 1987.
Derwent Abstracts, AN 85-305763, JP 60 195168, Oct. 3, 1985.

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