Curable resin composition

Details Curable resin composition Curable resin composition

2004-07-16

2009-08-18

Zimmer, Marc S (Department: 1796)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From silicon reactant having at least one...

C528S014000, C528S034000, C528S035000, C525S477000

Reexamination Certificate

active

07576167

ABSTRACT:
Disclosed is a moisture-curing type curable resin composition containing: a curable resin intramolecularly having a silicon-containing functional group; and a Lewis acid or a complex of the Lewis acid as a curing catalyst, the Lewis acid being selected from the group consisting of metal halides and boron halides, which is rapidly cured at room temperature. The silicon-containing functional group is represented by general formula: —SiX1X2X3or —SiR1X1X2(wherein, X1, X2and X3respectively represent a hydrolytic group and may be the same as or different from each other, and R1represents a substituted or unsubstituted organic group having 1 to 20 carbons). If the silicon-containing functional group is —SiR1X1X2, the curable resin further contains intramolecularly a polar component that is one of urethane, thiourethane, urea, thiourea, substituted urea, substituted thiourea, amide, and sulfide bonds, and hydroxyl, secondary amino and tertiary amino groups. Two-part type adhesive is constitutible with separating the curable resin from the curing catalyst.

REFERENCES:
patent: 5723516 (1998-03-01), Bigham et al.
patent: 6025445 (2000-02-01), Chiba et al.
patent: 2003/0149152 (2003-08-01), Hao
patent: 0145518 (1985-06-01), None
patent: 2230783 (1990-10-01), None
patent: 2-228376 (1990-09-01), None
patent: 2-233709 (1990-09-01), None
patent: 2-251274 (1990-10-01), None
patent: 4-103668 (1992-04-01), None
patent: 4-108863 (1992-04-01), None
patent: 10-204303 (1998-08-01), None
patent: 11-001635 (1999-01-01), None
patent: 11-228833 (1999-08-01), None
patent: 3030020 (2000-06-01), None
patent: WO 02/00784 (2003-01-01), None
patent: WO 03/029355 (2003-04-01), None
Nam, “Synthesis of New Separating Agents for Nuclear Materials”, Aug., 1998.

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