Curable resin and resin composition comprising the same

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

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525 98, 525102, 525105, 525106, 525123, 525194232, 525297, 525310, 525314, 5253321, 5253328, 5253329, 525338, 525342, 525350, 525353, 525375, 525376, 525379, 525385, 525386, 524554, C08L 5302, C08L 4700

Patent

active

061003395

DESCRIPTION:

BRIEF SUMMARY
BACKGROUND OF THE INVENTION

1. Field of the Invention
The present invention relates to a novel curable resin comprising a polymer which contains a cyclic monomer unit and which contains a reactive group, and a resin composition comprising the same. More particularly, the present invention is concerned with a curable resin comprising a polymer which contains a cyclic monomer unit derived from a cyclic conjugated diene and which contains a reactive group in a specific amount, and a resin composition comprising the curable resin. The curable resin and resin composition of the present invention is advantageous in that both the resin and the resin composition not only have excellent durability and resistance to chemicals as well as excellent thermal and mechanical properties, but also have excellent compatibility with other resins. Therefore, the resin and the resin composition can be advantageously used as a material for use in various fields, such as automobiles, construction, civil engineering, electric and electronic appliances, fiber industry, medical equipments and other resin products.
2. Prior Art
In recent years, polymer chemistry has continuously made progress through various innovations in order to meet commercial demands which have been increasingly diversified. Especially, in the field of polymer materials to be used as commercially important materials, extensive and intensive studies have been made toward developing polymers having more excellent thermal and mechanical properties. Various proposals have been made with respect to such polymers and methods for the production thereof. Of such polymers, a curable resin having functional groups which are introduced into the resin during or after the polymerization reaction for the production of a base resin has been drawing attention. With respect to such a curable resin, the thermal and mechanical properties thereof can be improved simply by reacting the functional groups contained in the curable resin. Therefore, such a curable resin has been used in a wide variety of fields.
Conventionally, various curable resins have been developed. With respect to the above-mentioned curable resin having functional groups (wherein the resin comprises a base polymer and functional groups which are bonded to the terminals of the molecular chain of the base polymer or inserted in the molecular chain of the base polymer), the improvement of properties of the resin is achieved by reacting the functional groups contained in the resin to form a crosslinked structure. Therefore, with respect to new development of curable resins, studies have conventionally been made with respect mainly to functional groups which are to be utilized for forming a crosslinked structure by UV crosslinking reaction, electron beam crosslinking reaction, ionic crosslinking reaction, wet crosslinking reaction (curing reaction) or various chemical crosslinking reactions (such as a transesterification, a hydrazone-forming reaction, a hydrazide-forming reaction, an oxime-forming reaction and an ammonium-forming reaction). An attempt to improve curable resins by improving a base polymer per se has almost not been made. However, in accordance with the recent tendency of diversification of commercial demands for curable resins, there has been a strong demand for curable resins which are improved not only in respect of resistance to chemicals and weather resistance as well as thermal and mechanical properties, but also in respect of the compatibility with other resins, so that it has recently been desired to develop a completely novel curable resin which is much improved in respect of the above-mentioned properties and characteristics.
For example, in the field of electronic appliances for use in telecommunication, public service, industry and the like, the demand for compactness and high density attachment of parts has greatly increased. Accordingly, there has also been an increasing demand for materials which are improved with respect to thermal resistance, dimensional stability, electrical propertie

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