Curable polyphenylene ether-thermosetting resin composition and

Details Curable polyphenylene ether-thermosetting resin composition and Curable polyphenylene ether-thermosetting resin composition and

1998-08-20

2000-04-18

Buttner, David

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525390, 525391, 525395, 525397, 524540, C08L 7112, C08L 6300

Patent

active

060516623

ABSTRACT:
Polyphenylene ether-thermosetting resin compositions are provided that are useful as dielectrics, particularly printed circuit boards having improved processability, good solvent and solder resistance, as well as improved morphology as compared to other polyphenylene ether-thermosetting resin compositions. More specifically, the particular polyphenylene ether resin component of this invention has a molecular weight of less than about 3,000 number average in contrast to higher molecular weight polyphenylene ethers employed in other polyphenylene ether-thermosetting resin compositions for use in preparing printed circuit boards.

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