Curable polyphenylene ether resin composition and a cured resin

Details Curable polyphenylene ether resin composition and a cured resin Curable polyphenylene ether resin composition and a cured resin

1990-02-07

1993-06-08

Ziegler, Jacob

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

4284228, 524 24, 524 35, 524151, 524409, 524513, 524514, 524524, 525151, 525391, 525905, C08K 506, C08L 7112

Patent

active

052180301

ABSTRACT:
A novel curable polyphenylene ether resin composition is disclosed, which comprises (a) a curable polyphenylene ether resin having at least one group selected from the group consisting of an allyl group and a propargyl group and (b) at least one cyanurate. The resin composition has excellent storage stability, film-forming properties and melt moldability. If desired, a fire retardant, optionally together with an antimony-containing auxiliary fire retardant, and/or a reinforcement is incorporated into the resin composition in order to improve the fire retardance and mechanical properties of the resin composition, respectively. By curing the resin composition, a cured polyphenylene ether resin composition comprising a chloroform nonextractable polyphenylene ether resin component and a chloroform extractable, polyphenylene ether-containing component is obtained, which has excellent chemical resistance, electrical properties, dimensional stability and heat resistance. A laminate or composite structure comprising the cured polyphenylene ether resin composition and a metallic foil and/or a metallic substrate provides advantageous mechanical and electronic components.

REFERENCES:
patent: 3422062 (1969-01-01), Segal et al.
patent: 3637578 (1972-01-01), Wright et al.
patent: 3936414 (1976-02-01), Wright et al.
patent: 4034136 (1977-07-01), Wright et al.
English-language Abstract of Japanese Patent Appln. No. 1-17492.
English-language Abstract of Japanese Patent Appln. No. 1-16410.
English-language Abstract of Japanese Patent Appln. No. 1-16409.

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