Curable polyphenylene ether-polyepoxide compositions from melt p

Details Curable polyphenylene ether-polyepoxide compositions from melt p Curable polyphenylene ether-polyepoxide compositions from melt p

1988-10-11

1991-03-19

Ziegler, Jacob

Stock material or miscellaneous articles

Composite

Of epoxy ether

428413, 428415, 428430, 428435, 428441, 525396, B32B 1704, B32B 2738

Patent

active

050010107

ABSTRACT:
Compositions comprising a polyepoxy compound (preferably bisphenol A diglycidyl ether) and a polyphenylene ether which has been melt processed (e.g., by extrusion) at a temperature in the range of about 230.degree.-390.degree. C., are cured at temperatures in the range of about 190.degree.-250.degree. C. by various epoxy cure catalysts. They may be used in the preparation of laminates with excellent dielectric properties, solvent resistance and solder resistance, useful in printed circuit board production.

REFERENCES:
patent: 4853423 (1989-08-01), Walles et al.

Affiliated with

Also associated with

Rating

Curable polyphenylene ether-polyepoxide compositions from melt p does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Curable polyphenylene ether-polyepoxide compositions from melt p, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Curable polyphenylene ether-polyepoxide compositions from melt p will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2009364