Curable polyphenylene ether-polyepoxide compositions from melt p

Details Curable polyphenylene ether-polyepoxide compositions from melt p Curable polyphenylene ether-polyepoxide compositions from melt p

1990-06-27

1992-08-25

Ziegler, Jacob

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428210, 428285, 428413, 428418, 428901, B32B 1508, B32B 1710

Patent

active

051417910

ABSTRACT:
Compositions comprising a polyepoxy compound (preferably bisphenol A diglycidyl ether) and a polyphenylene ether which has been melt processed (e.g., by extrusion) at a temperature in the range of about 230.degree.-390.degree. C., are cured at temperatures in the range of about 190.degree.-250.degree. C. by various epoxy cure catalysts. They may used in the preparation of laminates with excellent dielectric properties, solvent resistance and solder resistance, useful in printed circuit board production.

REFERENCES:
patent: 3375298 (1968-03-01), Fox
patent: 4853423 (1989-08-01), Walles et al.
patent: 4975319 (1990-12-01), Walles et al.

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