Curable organosiloxane compositions and semiconductor devices

Details Curable organosiloxane compositions and semiconductor devices Curable organosiloxane compositions and semiconductor devices

1996-07-30

1998-09-08

Marquis, Melvyn I.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

257783, 528 15, 528 16, 528 17, 524780, 524785, 427387, C08K 308

Patent

active

058046313

ABSTRACT:
A curable organosiloxane composition useable as a silicone die attach adhesive, an electrically conductive silicone rubber composition each comprising a composition that cures through both addition and condensation reactions, that will not impair wire bondability to a semiconductor chip or lead frame after the semiconductor chip has been bonded to a substrate or package; and semiconductor devices in which the semiconductor chip is bonded to its substrate or package using the curable organosiloxane composition and in which the semiconductor device that evidences high reliability by virtue of the use of the curable organosiloxane composition.

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patent: 5254656 (1993-10-01), Bilgrien et al.
patent: 5360858 (1994-11-01), Fujiki et al.
patent: 5384075 (1995-01-01), Okami
patent: 5449734 (1995-09-01), Kotani et al.
patent: 5504174 (1996-04-01), Onishi

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