Curable organopolysiloxane composition and semiconductor device

Details Curable organopolysiloxane composition and semiconductor device Curable organopolysiloxane composition and semiconductor device

2007-06-18

2011-12-20

Kopec, Mark (Department: 1761)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C525S407000, C526S194000, C528S010000

Reexamination Certificate

active

08080614

ABSTRACT:
A curable organopolysiloxane composition comprises at least the following components: an organopolysiloxane (A) represented by the following general formula: R13SiO(R12SiO)mSiR13(where R1is a monovalent hydrocarbon group, and “m” is an integer from 0 to 100); an organopolysiloxane (B) represented by the following average unit formula: (R2SiO3/2)a(R22SiO2/2)b(R23SiO1/2)c(where R2is a monovalent hydrocarbon group, and “a”, “b”, and “c” are specific numbers); an organopolysiloxane (C) having in one molecule on average at least two silicon-bonded aryl groups and on average at least two silicon-bonded hydrogen atoms; and a hydrosilylation-reaction catalyst (D); is characterized by good fillability and curability and that, when cured, forms a cured body that possesses a high refractive index, high light transmissivity, and strong adhesion to various substrates.

REFERENCES:
patent: 6001943 (1999-12-01), Enami et al.
patent: 2008/0262158 (2008-10-01), Morita et al.
patent: 08176447 (1996-07-01), None
patent: 11001619 (1999-01-01), None
patent: 2003128992 (2003-05-01), None
patent: WO 0117570 (2001-03-01), None
English language translation and abstract for JP 08176447 extracted from PAJ database dated Dec. 9, 2007, 39 pages.
English language translation and abstract for JP 11001619 extracted from PAJ database dated May 26, 2009, 33 pages.
English language translation and abstract for JP 2003128992 extracted from PAJ database dated May 26, 2009, 24 pages.
PCT International Search Report for PCT/JP2007/062649, dated Sep. 13, 2007, 3 pages.

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